MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

Title:

MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

Document Type and Number:

WIPO Patent Application WO/2023/238950

Kind Code:

A1

Abstract:

A molding resin composition according to the present invention includes a curable resin, an inorganic filler, and a stress relaxer. The inorganic filler includes: at least one of silica particles and alumina particles; and calcium titanate particles. The stress relaxer includes at least one of an indene/styrene/coumarone copolymer, a trialkyl phosphine oxide, and a triaryl phosphine oxide.

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Inventors:

YAMAUCHI ARISA (JP)
YAMAURA MASASHI (JP)
HIRAI TOMOKI (JP)
TANAKA MIKA (JP)
NAKAYAMA AYUMI (JP)
SUKEGAWA YUTA (JP)

Application Number:

PCT/JP2023/021622

Publication Date:

December 14, 2023

Filing Date:

June 09, 2023

Export Citation:

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Assignee:

RESONAC CORP (JP)

International Classes:

C08L101/00; C08K3/22; C08K3/24; C08K3/36; C08L45/02; C08L61/28; C08L63/00; C08L67/00; H01L23/29; H01L23/31

Domestic Patent References:

WO2019131095A1

2019-07-04

Foreign References:

JP6870778B1	2021-05-12
JP2020122115A	2020-08-13

Attorney, Agent or Firm:

TAIYO, NAKAJIMA & KATO (JP)

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