Title:
RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/238951
Kind Code:
A1
Abstract:
This resin composition for molding contains: an epoxy resin; a curing agent containing an active ester compound and a phenol curing agent; and an inorganic filler containing calcium titanate particles.
Inventors:
YAMAURA MASASHI (JP)
NAKAYAMA AYUMI (JP)
HIRAI TOMOKI (JP)
YAMAUCHI ARISA (JP)
TANAKA MIKA (JP)
SUKEGAWA YUTA (JP)
NAKAYAMA AYUMI (JP)
HIRAI TOMOKI (JP)
YAMAUCHI ARISA (JP)
TANAKA MIKA (JP)
SUKEGAWA YUTA (JP)
Application Number:
PCT/JP2023/021623
Publication Date:
December 14, 2023
Filing Date:
June 09, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L63/00; C08K3/24; C08K5/10; C08K5/13; C08L45/02; C08L61/28; C08L67/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2020262654A1 | 2020-12-30 | |||
| WO2005085316A1 | 2005-09-15 |
Foreign References:
| JP6870778B1 | 2021-05-12 | |||
| JP2021116329A | 2021-08-10 | |||
| JP2001131393A | 2001-05-15 | |||
| JP2015036410A | 2015-02-23 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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