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Patent Searching and Data


Title:
MOLDINGS HAVING INK LAYER
Document Type and Number:
WIPO Patent Application WO/2001/009228
Kind Code:
A1
Abstract:
A molding having an ink layer, characterized in that the molding is one formed from an alicyclic polymer and the ink layer has been pattern-wise formed on the surface of the molding, and that when a 1-cm?2¿ part arbitrarily selected from that surface of the molding which has the patterned ink layer is subjected to a tape peeling adhesion test, the retention of the ink layer is 80% or higher; and a molding having an ink layer, wherein the molding is one formed from an alicyclic polymer and the ink layer has been pattern-wise formed on the surface of the molding and has an index of wetting of 42 dyne/cm or lower.

Inventors:
TAZAKI SATOSHI (JP)
Application Number:
PCT/JP2000/005138
Publication Date:
February 08, 2001
Filing Date:
July 31, 2000
Export Citation:
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Assignee:
ZEON CORP (JP)
TAZAKI SATOSHI (JP)
International Classes:
B41M1/30; C08J5/18; C09D11/033; C09D11/037; C08J7/04; C09D11/10; C09D11/103; C09D11/104; C09D11/106; C09D11/107; C09D11/108; F21V8/00; G02B6/00; G02F1/1335; G02F1/13357; (IPC1-7): C08J7/04; B32B27/00
Foreign References:
JPH08201618A1996-08-09
JPH04122639A1992-04-23
JPH0894852A1996-04-12
JPH08302046A1996-11-19
JPH0812787A1996-01-16
JPH04372901A1992-12-25
Attorney, Agent or Firm:
Nishikawa, Shigeaki (Higashi-Nippori 3-chome Arakawa-ku, Tokyo, JP)
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