Title:
MOLTEN RESIN COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/214555
Kind Code:
A1
Abstract:
Provided is a hot cut-type molten resin cooling device with which it is possible to improve cooling efficiency. This hot cut-type molten resin cooling device 1 comprises: a cylindrical case body 5 which has a cooling chamber 5a formed thereinside; an introduction pipe 6 which is connected to an axially one-end side of the case body 5 and through which air is introduced into the cooling chamber 5a; an ejection unit 7 which ejects water into the inside of the introduction pipe 6; a die 3 which extrudes molten resin into the cooling chamber 5a; a cutter 4 which cuts the resin extruded from the die 3; a drawing-out pipe 8 which is connected to the axially other-end side of the case body 5 and through which the cooled and solidified resin and heated air are drawn out; and a helical guideway 9 which is formed on the inner circumferential surface of the case body 5 and which guides both cooling air and the resin that has been cut by the cutter.
Inventors:
YASUDA MAKOTO (JP)
Application Number:
PCT/JP2023/016992
Publication Date:
November 09, 2023
Filing Date:
April 29, 2023
Export Citation:
Assignee:
SHONANTRADING CO LTD (JP)
YASUDA MAKOTO (JP)
YASUDA MAKOTO (JP)
International Classes:
B29B9/06; B29B7/82; B29C48/345; B29C48/88
Foreign References:
| JPH11300739A | 1999-11-02 | |||
| JP2012200933A | 2012-10-22 | |||
| US20160354949A1 | 2016-12-08 | |||
| CN110181705A | 2019-08-30 |
Attorney, Agent or Firm:
SHIGEIZUMI, Tatsushi (JP)
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