MONOMER MIXTURE AND CURABLE COMPOSITION CONTAINING SAME

Title:

MONOMER MIXTURE AND CURABLE COMPOSITION CONTAINING SAME

Document Type and Number:

WIPO Patent Application WO/2019/021932

Kind Code:

A1

Abstract:

Provided is a monomer mixture which has the ability to cure quickly, and forms a cured product having a high hardness and excellent alkali resistance and adhesion to a base material. This monomer mixture according to the present invention contains: a compound represented by formula (a-1) and/or a compound represented by (a-2); a compound (2B) having two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound (3B) having three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group. The total contained amount of the compound represented by formula (a-1) and the compound represented by formula (a-2) is 1-20 wt% of the entire amount of the monomer mixture, the compound (2B) contains a compound represented by formula (2b-1), the contained amount of the compound represented by formula (2b-1) is 5 wt% or more of the monomer mixture, and the ratio of the contained amounts of the compound (2B)/the compound (3B) is 5-20.

Inventors:

MIZUTA TOMOYA (JP)
INOUE KEIZO (JP)

Application Number:

PCT/JP2018/027109

Publication Date:

January 31, 2019

Filing Date:

July 19, 2018

Export Citation:

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Assignee:

DAICEL CORP (JP)

International Classes:

C08G59/20; C09D11/30

Domestic Patent References:

WO2017094809A1	2017-06-08
WO2015111525A1	2015-07-30

Foreign References:

JP2017115072A	2017-06-29
JP2016027127A	2016-02-18
JP2017147078A	2017-08-24
JP2007211098A	2007-08-23
JP2007211099A	2007-08-23
JP2005154734A	2005-06-16
JP2016027127A	2016-02-18

Other References: