MONOMER MIXTURE AND CURABLE COMPOSITION CONTAINING SAME

Title:

MONOMER MIXTURE AND CURABLE COMPOSITION CONTAINING SAME

Document Type and Number:

WIPO Patent Application WO/2019/021933

Kind Code:

A1

Abstract:

Provided is a monomer mixture which is quickly cured to form a cured product having a high hardness and excellent alkali resistance and adhesion to a base material. This monomer mixture according to the present invention at least contains: a compound represented by formula (a-1) and/or a compound represented by formula (a-2); a compound (2B) having two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; a compound (3B) having three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound represented by formula (c-1). The total contained amount of the compound represented by formula (a-1) and the compound represented by formula (a-2) is 1-20 wt% of the entire amount of the monomer mixture, the ratio of the contained amounts of the compound (2B)/the compound (3B) is 0.1-3.0, and the contained amount of the compound represented by formula (c-1) is 5-95 wt% of the entire amount of the monomer mixture.

Inventors:

MIZUTA TOMOYA (JP)
INOUE KEIZO (JP)

Application Number:

PCT/JP2018/027110

Publication Date:

January 31, 2019

Filing Date:

July 19, 2018

Export Citation:

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Assignee:

DAICEL CORP (JP)

International Classes:

C08G59/24; C08G59/38; C08G65/26; C09D11/30

Domestic Patent References:

WO2017094809A1	2017-06-08
WO2015111525A1	2015-07-30

Foreign References:

JP2017115072A	2017-06-29
JP2016027127A	2016-02-18
JP2017147076A	2017-08-24
JP2007211098A	2007-08-23
JP2007211099A	2007-08-23
JP2005154734A	2005-06-16
JP2016027127A	2016-02-18

Other References: