Title:
MOUNTER CUTTING DEVICE FOR SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/097882
Kind Code:
A1
Abstract:
The present invention comprises: a cutter frame on which a driving means is mounted; a driving cam coupled to the lower surface of the cutter frame; a rotating shaft member connected to the driving means to rotate; a transfer panel, which is coupled to the lower end of the rotating shaft member, and is formed to slide in the X-axis direction; a plurality of driving support blocks, which are coupled to both sides of the lower portion of the transfer panel, and slide in opposite directions; a driving guide unit formed to roll along the outer surface of the driving cam when the rotating shaft member rotates; a rotation guide member moving along the upper surface of a wafer frame; and a cutting means for removing a remaining portion of UV tape attached to the wafer frame.
Inventors:
YANG HAE CHOON (KR)
Application Number:
PCT/KR2021/010093
Publication Date:
May 12, 2022
Filing Date:
August 03, 2021
Export Citation:
Assignee:
TONITEC CO LTD (KR)
International Classes:
H01L23/00; H01L21/78
Foreign References:
| KR101431206B1 | 2014-08-19 | |||
| KR100365474B1 | 2002-12-26 | |||
| JP2011077443A | 2011-04-14 | |||
| JP4417028B2 | 2010-02-17 | |||
| US20100078114A1 | 2010-04-01 |
Attorney, Agent or Firm:
JUNG, Chang Su (KR)
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