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Title:
MOUNTING APPARATUS AND MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/026909
Kind Code:
A1
Abstract:
Provided is a mounting apparatus (10) which combines a semiconductor wafer (W), which has an adhesive sheet (S) adhered on one surface, with a ring frame (F).  The mounting apparatus (10) preliminarily peels a part of the adhesive sheet (S) by means of a preliminary peeling means (15) so as to form a preliminary peeled section (S1), then, the wafer (W) is arranged inside the ring frame (F), and a mount tape (T) is adhered on the ring frame (F) and the wafer (W) by means of an adhering means (17).  The adhesive sheet is completely peeled from the mounted wafer (W) by holding the preliminary peeled section (S1).

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Inventors:
KOBAYASHI KENJI (JP)
Application Number:
PCT/JP2009/064910
Publication Date:
March 11, 2010
Filing Date:
August 27, 2009
Export Citation:
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Assignee:
LINTEC CORP (JP)
KOBAYASHI KENJI (JP)
International Classes:
H01L21/683
Foreign References:
JP2007311612A2007-11-29
JP2007329315A2007-12-20
JP2007311735A2007-11-29
JP2006100728A2006-04-13
JPS63137449A1988-06-09
JP2009141314A2009-06-25
JP2009065108A2009-03-26
JP2009060039A2009-03-19
Attorney, Agent or Firm:
YAMAGUCHI YOSHIO (JP)
Yoshio Yamaguchi (JP)
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