Title:
MOUNTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/021396
Kind Code:
A1
Abstract:
[Problem] To provide a technique enabling a reduction in burden associated with configuration work needed in mounting components onto a substrate. [Solution] A mounting apparatus for mounting a component onto a substrate on the basis of mounting-related information needed in mounting the component onto the substrate, comprising a processing unit and a storage unit. The processing unit generates the mounting-related information on the basis of definition information upon identifying the presence of a definition file in the storage unit, said file containing the definition information which defines the information needed in mounting the component onto the substrate.
Inventors:
OHASHI TERUYUKI (JP)
KURASHINA TAKASHI (JP)
KITAYAMA JUN (JP)
KURASHINA TAKASHI (JP)
KITAYAMA JUN (JP)
Application Number:
PCT/JP2017/027082
Publication Date:
January 31, 2019
Filing Date:
July 26, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/00
Foreign References:
| JPH09204454A | 1997-08-05 | |||
| JP2002198698A | 2002-07-12 | |||
| JP2005136276A | 2005-05-26 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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