MOUNTING STRUCTURE AND MOUNTING PROCESS FROM SEMICONDUCTOR DEVICES

Title:

MOUNTING STRUCTURE AND MOUNTING PROCESS FROM SEMICONDUCTOR DEVICES

Document Type and Number:

WIPO Patent Application WO1998032159

Kind Code:

A3

Abstract:

The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device, such as CSP/BGA, to be securely fixed to a circuit board by short-time heat curing, which exhibits good productivity, and excellent heat shock properties (or thermal cycle properties), and which permits the semiconductor device to be easily removed from the circuit board in the event of failure. This invention also provides a mounting process for semiconductor devices.

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Inventors:

IIDA KAZUTOSHI (JP)
WIGHAM JON (JP)
WATANABE MASAKI (JP)
MEGURO TAKESHI (JP)

Application Number:

PCT/US1998/000856

Publication Date:

February 18, 1999

Filing Date:

January 16, 1998

Export Citation:

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Assignee:

LOCTITE CORP (US)
MATSUSHITA ELECTRIC IND CO LTD (US)
IIDA KAZUTOSHI (US)
WIGHAM JON (US)
WATANABE MASAKI (US)
MEGURO TAKESHI (US)

International Classes:

C08G59/24; H01L21/56; H01L21/60; H01L23/29; H01L23/31; H05K3/28; H05K3/34; (IPC1-7): H01L/

Foreign References:

US5371328A	1994-12-06
US5355580A	1994-10-18
US5274913A	1994-01-04
US5250848A	1993-10-05
US5120665A	1992-06-09

Other References: