Title:
MULTI-DETECTOR MICROSCOPIC INSPECTION SYSTEM
Document Type and Number:
WIPO Patent Application WO2003067632
Kind Code:
B1
Abstract:
Techniques for utilizing a microscope inspection system (100) capable of inspecting specimens (112) at high throughput rates are described. The inspection system achieves the higher throughput rates by utilizing more than one detector array (116) and a large field of view to scan the surface of the semiconductor wafers. The microscope inspection system also has high magnification capabilities, a high numerical aperture, and a large field of view. By using more than one detector array, more surface area of a wafer can be inspected during each scanning swath across the semiconductor wafers. The microscope inspection system is configured to have a larger field of view so that the multiple detector arrays can be properly utilized. Additionally, special arrangements of reflective and/or refractive surfaces are used in order to fit the detector arrays within the physical constraints of the inspection system.
Inventors:
LANGE STEVEN R
Application Number:
PCT/US2003/003585
Publication Date:
May 27, 2004
Filing Date:
February 05, 2003
Export Citation:
Assignee:
KLA TENCOR TECH CORP (US)
International Classes:
G01N21/956; G01Q30/20; G02B17/08; G02B21/00; G02B21/06; G02B21/02; G02B21/04; G02B21/18; G01Q10/00; (IPC1-7): G02B27/12; G02B21/06; G02B15/14; G02B5/08; G21K7/00
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