Title:
MULTI-LAYER SUBSTRATE, ELECTRONIC APPARATUS, AND METHOD FOR PRODUCING MULTI-LAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/163859
Kind Code:
A1
Abstract:
A multi-layer substrate (101) is provided with a laminate (10A) formed by layering a plurality of insulating substrate layers (11, 12, 13, 14, 15), and mounting electrodes (P1, P2) having mutually opposed first surfaces (S1A, S1B) and second surfaces (S2A, S2B). The mounting electrodes (P1, P2) are interposed between a first insulating substrate layer (insulating substrate layer (11)) and a second insulating substrate layer (insulating substrate layer (12)) such that the first surface (S1A) faces the first insulating substrate layer and such that the second surfaces (S2A, S2B) face the second insulating substrate layer. The surface roughness (Ra1) of the first surfaces (S1A, S1B) is greater than the surface roughness (Ra2) of the second surfaces (S2A, S2B) (Ra1 > Ra2). The first insulating substrate layer (insulating substrate layer (11)) has substrate layer non-formation parts (NFP1, NFP2) where parts of the first surfaces (S1A, S1B) are exposed.
More Like This:
| JP2004014550 | CONDUCTIVE SHEET |
| JP4398766 | Thermal head and its manufacturing method |
| JPH0617012 | ADHESIVE SHEET |
Inventors:
ITO SHINGO (JP)
Application Number:
PCT/JP2018/006679
Publication Date:
September 13, 2018
Filing Date:
February 23, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/38; H01L23/12; H05K1/18; H05K3/46
Foreign References:
| JP2004207636A | 2004-07-22 | |||
| JP2005072085A | 2005-03-17 | |||
| JP2011258590A | 2011-12-22 | |||
| JPS4816157A |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
Download PDF: