Title:
MULTI-LAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/159485
Kind Code:
A1
Abstract:
A multi-layer substrate (101) is provided with: a laminated body (10) formed by laminating a plurality of insulating base material layers; a first coil (L1) and a second coil (L2) that are formed on the laminated body (10); a driver (IC3); and magnetic sensors (1, 2) that are connected to the driver IC (3). The winding axis (AX1) of the first coil (L1) and the winding axis (AX2) of the second coil (L2) are parallel to the lamination direction (Z-axis direction). The laminated body (10) has an IC arrangement region (AD) therewithin. The IC arrangement region (AD) is an area interposed between a formation area (FE1) of the first coil (L1) and a formation area (FE2) of the second coil (L2). At least a part of the driver IC (3) is disposed in the IC arrangement area (AD).
Inventors:
YOSUI KUNIAKI (JP)
ITO SHINGO (JP)
ITO SHINGO (JP)
Application Number:
PCT/JP2018/006676
Publication Date:
September 07, 2018
Filing Date:
February 23, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H01L23/12; H05K1/16; H05K3/00
Domestic Patent References:
| WO2015079773A1 | 2015-06-04 | |||
| WO2015129601A1 | 2015-09-03 | |||
| WO2014115434A1 | 2014-07-31 |
Foreign References:
| JP2012032526A | 2012-02-16 | |||
| JP2015050643A | 2015-03-16 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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