Title:
MULTI-LAYERED FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2024/029979
Kind Code:
A1
Abstract:
A multi-layered flexible printed circuit board of the present disclosure may comprise: a first flexible printed circuit board (FPCB) including a first curved area in which a conductive layer for signal transfer is arranged, wherein the first FPCB includes a first dummy area extending from the first curved area; a second FPCB including a second curved area in which a conductive layer for signal transfer is arranged, wherein the second FPCB includes a second dummy area extending from the second curved area; and a bonding layer in which the first dummy area and the second dummy area are bonded to each other.
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Inventors:
JUNG YOUNGJIN (KR)
KWON KIHWAN (KR)
PARK HONJEONG (KR)
CHO SUJIN (KR)
CHUN WOOSUNG (KR)
KWON KIHWAN (KR)
PARK HONJEONG (KR)
CHO SUJIN (KR)
CHUN WOOSUNG (KR)
Application Number:
PCT/KR2023/011462
Publication Date:
February 08, 2024
Filing Date:
August 04, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04M1/02; H05K1/02; H05K1/14; H05K3/28; H05K3/46
Foreign References:
| KR20220016591A | 2022-02-10 | |||
| JP2010109152A | 2010-05-13 | |||
| US20160073032A1 | 2016-03-10 | |||
| KR20210050040A | 2021-05-07 | |||
| KR20160050023A | 2016-05-10 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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