Title:
MULTI-MODE 90-DEGREE-BEND WAVEGUIDE ARRAY CHIP
Document Type and Number:
WIPO Patent Application WO/2018/072489
Kind Code:
A1
Abstract:
A multi-mode 90-degree-bend waveguide array chip comprises a main chip (5) comprising a substrate (1), waveguides (2), and a packaging layer (3). The packaging layer (3) is configured to package the waveguides (2) to be above the substrate (1). The waveguides (2) are arranged in parallel, and are equal in spaces therebetween. One sides of the waveguides comprise total reflection surfaces (4). A number of the waveguides (2) and a distance between the waveguides (2) are adjustable based on actual requirements. The embodiment introduces no lens, and has a short optical path, facilitating optical integration. The embodiment can be directly coupled without an adding and attaching procedure of a lens array, providing high coupling precision, and better overall optical path stability.
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Inventors:
YIN XIAOJIE (CN)
SUN JINGWEN (CN)
LIU YAO (CN)
ZHANG JIASHUN (CN)
AN JUNMING (CN)
ZHONG FEI (CN)
CHANG XIASEN (CN)
SUN JINGWEN (CN)
LIU YAO (CN)
ZHANG JIASHUN (CN)
AN JUNMING (CN)
ZHONG FEI (CN)
CHANG XIASEN (CN)
Application Number:
PCT/CN2017/092802
Publication Date:
April 26, 2018
Filing Date:
July 13, 2017
Export Citation:
Assignee:
HENAN SHIJIA PHOTONS TECH CO LTD (CN)
International Classes:
G02B6/122
Foreign References:
| CN106371169A | 2017-02-01 | |||
| CN105334580A | 2016-02-17 | |||
| CN102289036A | 2011-12-21 | |||
| CN105158848A | 2015-12-16 | |||
| CN103998961A | 2014-08-20 | |||
| JP2006201499A | 2006-08-03 | |||
| JP2003215371A | 2003-07-30 |
Attorney, Agent or Firm:
ZHENGZHOU YOUDUN INTELLCTUAL PROPERTY AGENCY CO., LTD. (CN)
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