Title:
MULTILAYER METAL BALL
Document Type and Number:
WIPO Patent Application WO/2018/056313
Kind Code:
A1
Abstract:
Provided is a multilayer metal ball having excellent spacer function and high bonding reliability. The multilayer metal ball 1 comprises a core ball 2 formed from Sn or Sn alloy, and an intermediate plated layer 3 of which the thickness is optimally selected so as to enable the formation of the multilayer metal ball 1 having high sphericity, thereby achieving high bonding reliability. In the multilayer metal ball 1, the intermediate plated layer 3 is thickly formed on the surface of the core ball 2, whereby deformation of the ball during application of load or heating in a reflow step can be suppressed, thus achieving stable spacer function. Accordingly, the multilayer metal ball 1 having excellent spacer function and high bonding reliability is provided.
Inventors:
HASHINO EIJI (JP)
UNO TOMOHIRO (JP)
AKASHI KEISUKE (JP)
KIMURA KATSUICHI (JP)
UNO TOMOHIRO (JP)
AKASHI KEISUKE (JP)
KIMURA KATSUICHI (JP)
Application Number:
PCT/JP2017/033931
Publication Date:
March 29, 2018
Filing Date:
September 20, 2017
Export Citation:
Assignee:
NIPPON STEEL & SUMIKIN MAT CO (JP)
NIPPON MICROMETAL CORP (JP)
NIPPON MICROMETAL CORP (JP)
International Classes:
B22F1/00; B23K35/14; B23K35/26; C22C13/00; C22C13/02; C22C19/03
Domestic Patent References:
| WO2013141166A1 | 2013-09-26 |
Foreign References:
| JP2003225790A | 2003-08-12 | |||
| JP2016155173A | 2016-09-01 | |||
| JP2009095865A | 2009-05-07 |
Attorney, Agent or Firm:
YOSHIDA Tadanori (JP)
Download PDF: