MULTILAYER PANEL FOR SPOT-WELDING, AND PANEL JOINING STRUCTURE

Title:

MULTILAYER PANEL FOR SPOT-WELDING, AND PANEL JOINING STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2023/032149

Kind Code:

A1

Abstract:

Provided is a low-weight and high-rigidity panel member that can be spot-welded. This multilayer panel for spot-welding comprises a steel-member outer layer and a resin-member layer, wherein an electricity-conductible part from which the resin-member layer is partially removed is provided at a location to be joined through spot-welding.

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Inventors:

YOSHIDA TOMOYA (JP)
KANEDA TAKAYUKI (JP)
KAWAI KOSUKE (JP)

Application Number:

PCT/JP2021/032430

Publication Date:

March 09, 2023

Filing Date:

September 03, 2021

Export Citation:

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Assignee:

SUBARU CORP (JP)

International Classes:

B32B15/08; B23K11/11; B23K11/16; B32B3/24

Foreign References:

JPS60179434U	1985-11-28
JP2018501984A	2018-01-25
JPH04257432A	1992-09-11
JP2016059954A	2016-04-25
US4791765A	1988-12-20
JPH05111978A	1993-05-07
JPS60166534U	1985-11-05

Attorney, Agent or Firm:

EBISU INTERNATIONAL PATENT OFFICE (JP)

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