Title:
MULTILAYER PRINTED WIRING BOARD PRODUCTION METHOD, ADHESIVE LAYER-EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/026501
Kind Code:
A1
Abstract:
Provided is a multilayer printed wiring board production method having the following steps 1-3. Step 1: a step for laminating, on an inner layer circuit-equipped substrate via an organic insulating resin layer, an adhesive layer-equipped metal foil having, sequentially, a support body, a metal foil that is at most 3 μm thick and is at most 1/6 the thickness of the inner layer circuit, and an organic adhesive layer that is at most 10 μm thick such that the organic insulating resin layer and the organic adhesive layer face each other, and thereafter peeling off the support body to form a laminate (a) having the metal foil as an outer layer metal foil layer. Step 2: a step for irradiating the laminate (a) with a laser to create a hole in the outer layer metal foil layer, the organic adhesive layer, and the organic insulating resin layer to form a perforated laminate (b) having a blind via hole. Step 3: a step for forming an outer layer circuit connected to the inner layer circuit by the following steps 3-1 to 3-4. Step 3-1: a step for forming an outer layer copper layer that is at most 2 μm thick on the perforated laminate (b) after removing by etching the outer layer metal foil layer of the perforated laminate (b) formed in step 2. Step 3-2: a step for forming a resist pattern by a resist coated on the outer layer copper layer. Step 3-3: a step for forming a circuit layer by electrolytic copper plating on the surface of the outer layer copper layer on which the resist pattern is not formed. Step 3-4: a step for forming an outer layer circuit connected to the inner layer circuit by removing by etching the exposed outer layer copper layer after the resist pattern has been removed.
Inventors:
ONOZEKI HITOSHI (JP)
INOUE TSUBASA (JP)
YAMAGISHI KATSUJI (JP)
SHIMIZU HIROSHI (JP)
INOUE TSUBASA (JP)
YAMAGISHI KATSUJI (JP)
SHIMIZU HIROSHI (JP)
Application Number:
PCT/JP2016/073513
Publication Date:
February 16, 2017
Filing Date:
August 10, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K3/46; H05K3/00
Foreign References:
| JPH1187931A | 1999-03-30 | |||
| JPH10247781A | 1998-09-14 | |||
| JP2001260274A | 2001-09-25 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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