Title:
MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/066324
Kind Code:
A1
Abstract:
This multilayer substrate (101) is provided with: a laminate (10A) that is obtained by laminating a plurality of insulating base material layers (11a, 12a, 13a, 14a, 15a); an (IC31) that is contained within the laminate (10A); a first conductor (a first main surface-side conductor (1A)) that is contained within the laminate (10A); and a second conductors (conductors (21, 22) or the like) that are formed in the laminate (10A). The IC31 has a main surface (a first main surface (S1)). The outer surface of the IC31 is covered by an insulating resin that exhibits fluidity during the formation of the laminate (10A). The first conductor has a facing surface (S11A) that faces the first main surface (S1), and is arranged between the first main surface (S1) and the insulating base material layer (12a). The surface roughness (R11A) of the facing surface (S11A) is higher than the lowest surface roughness (R21) among the surface roughnesses of the second conductors and is not lower than the highest surface roughness (R22) among the surface roughnesses of the second conductors (R11A ≥ R22 > R21).
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Inventors:
YOSUI KUNIAKI (JP)
Application Number:
PCT/JP2017/032909
Publication Date:
April 12, 2018
Filing Date:
September 12, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H05K1/02
Domestic Patent References:
| WO2014125894A1 | 2014-08-21 |
Foreign References:
| JP2004153084A | 2004-05-27 | |||
| JP2004134669A | 2004-04-30 | |||
| JP2007535156A | 2007-11-29 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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