Title:
MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/176643
Kind Code:
A9
Abstract:
A multilayer substrate according to one mode of the present invention comprises: a laminate having a plurality of laminated flexible resin layers, a space being provided inside the laminate; a first inner layer resin disposed in the space within the laminate; and a plurality of conductors, including signal conductors, that are arranged in the first inner layer resin. At least a portion of the first inner layer resin is separated from the laminate inside the space.
Inventors:
KATSURA TOMONORI (JP)
SHIMIZU KOUKI (JP)
SHIMIZU KOUKI (JP)
Application Number:
PCT/JP2023/008894
Publication Date:
January 18, 2024
Filing Date:
March 08, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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