Title:
MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/234023
Kind Code:
A1
Abstract:
The present invention provides a multilayer substrate which is not susceptible to cracking or separation at a connection part of an electrode that is provided on a ceramic layer and an interlayer connection conductor that is provided in a thermoplastic resin layer even in cases where a thermal stress occurs. A multilayer substrate (1) according to the present invention is provided with: a first thermoplastic resin layer (21) which has a first main surface (21a) and a second main surface (21b) that is opposite to the first main surface (21a), and which has a via hole (21h) that penetrates therethrough from the first main surface (21a) to the second main surface (21b); a ceramic layer (11) which is arranged so as to be in contact with the first main surface (21a); and a second thermoplastic resin layer (22) which is arranged so as to be in contact with the second main surface (21b). A first electrode (31) is formed on a main surface of the ceramic layer (11) which is in contact with the first main surface (21a); a protective layer (40) is additionally formed on the main surface of the ceramic layer (11) so as to cover at least a part of the outline of the first electrode (31); a second electrode (32) is formed on a main surface of the second thermoplastic resin layer (22) which is in contact with the second main surface (21b); an interlayer connection conductor (50), which connects the first electrode (31) and the second electrode (32) to each other, is arranged in the via hole (21h); and an intermetallic compound (61) is formed between the interlayer connection conductor (50) and the first electrode (31).
Inventors:
YAMAMOTO ISSEI (JP)
YAMAMOTO TOMOKI (JP)
YAMAMOTO TOMOKI (JP)
Application Number:
PCT/JP2023/018392
Publication Date:
December 07, 2023
Filing Date:
May 17, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H05K1/11
Domestic Patent References:
| WO2017150611A1 | 2017-09-08 | |||
| WO2021084860A1 | 2021-05-06 | |||
| WO2019003729A1 | 2019-01-03 |
Foreign References:
| JP2010098291A | 2010-04-30 | |||
| JP2014160705A | 2014-09-04 | |||
| JP2010232596A | 2010-10-14 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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