Title:
MULTILAYER WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/146931
Kind Code:
A1
Abstract:
This multilayer wiring board is provided with: a first metal foil wiring layer, which has at least two layers of metal foil wiring, and which is disposed on the mounting surface side where a surface-mounting component is mounted; a wiring layer, which is disposed on the reverse side of the mounting surface, and which has an insulated wire wired therein; and a first interlayer through hole having a conductive portion for electrically connecting the metal foil wiring, which is positioned on the surface of the first metal foil wiring layer, to the metal foil wiring of an inner layer of the first metal foil wiring layer and/or to the insulated wire of the wiring layer. The diameter of the first interlayer through hole varies in the board thickness direction of the multilayer wiring board.
Inventors:
YAMAGUCHI HIROYUKI (JP)
KURIHARA SEIICHI (JP)
SAKURAI HIROSHI (JP)
NUKINA SHUNSUKE (JP)
KURIHARA SEIICHI (JP)
SAKURAI HIROSHI (JP)
NUKINA SHUNSUKE (JP)
Application Number:
PCT/JP2013/059111
Publication Date:
October 03, 2013
Filing Date:
March 27, 2013
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K3/46
Foreign References:
| JP2001339157A | 2001-12-07 | |||
| JP2002335079A | 2002-11-22 | |||
| JPS62295491A | 1987-12-22 | |||
| JP2011198827A | 2011-10-06 | |||
| JP2004342978A | 2004-12-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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