NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND MEMBER FOR TOUCH PANEL

Title:

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND MEMBER FOR TOUCH PANEL

Document Type and Number:

WIPO Patent Application WO/2013/125637

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a composition which ensures a large development margin and which exhibits an excellently improved adhesion to a metal or inorganic substrate surface. The present invention is a negative photosensitive resin composition characterized by comprising a silane coupling agent represented by a specific general formula, an alkali-soluble resin, a polyfunctional acrylic monomer and a photo-radical polymerization initiator.

Inventors:

OKAZAWA TORU (JP)
ONO KOICHIRO (JP)
SUWA MITSUHITO (JP)

Application Number:

PCT/JP2013/054341

Publication Date:

August 29, 2013

Filing Date:

February 21, 2013

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Assignee:

TORAY INDUSTRIES (JP)

International Classes:

G03F7/075; G02B1/10; G02B1/14; G03F7/027; G06F3/041

Foreign References:

JP2008129463A	2008-06-05
JP2008032860A	2008-02-14
JP2000035670A	2000-02-02
JP2007520737A	2007-07-26
JP2012185408A	2012-09-27

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