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Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED FILM USING THIS, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2020/179744
Kind Code:
A1
Abstract:
A negative photosensitive resin composition is provided which has high resolution, has high pencil hardness even when cured at a low temperature of less than or equal to 150°C, has excellent chemical resistance and weatherability, and can form a cured film that enables suppressing outgassing during electrode/wiring processing. This negative photosensitive resin composition contains (A) a siloxane resin which has a radical polymerizable group, (B) a monomer which has a radical polymerizable group, and (C) a photo radical polymerization initiator which has an absorption peak in the wavelength range 350-370 nm and in which the light absorption at wavelength 400 nm is 10% or less than the light absorption at wavelength 365 nm.

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Inventors:
FUKUZAKI YUSUKE (JP)
SENOO MASAHIDE (JP)
Application Number:
PCT/JP2020/008738
Publication Date:
September 10, 2020
Filing Date:
March 02, 2020
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/038; G03F7/075; G06F3/041
Domestic Patent References:
WO2018021184A12018-02-01
WO2018105532A12018-06-14
Foreign References:
JP2017219850A2017-12-14
JP2018146958A2018-09-20
JP2017003995A2017-01-05
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