Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIST FILM, PATTERN FORMING METHOD, CURED FILM, AND PRODUCTION METHOD FOR CURED FILM
Document Type and Number:
WIPO Patent Application WO/2018/043395
Kind Code:
A1
Abstract:
This negative photosensitive resin composition comprises an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator (I). The cation polymerization initiator (I) is characterized by containing one or more selected from the group consisting of compounds represented by general formula (I1) and compounds represented by general formula (I2). In formula (I1), Rb01-Rb04 each represent an optionally substituted aryl group or a fluorine atom. In formula (I2), Rb05 represents an optionally substituted fluorinated alkyl group or a fluorine atom. The plurality of Rb05 may be the same or different from one another. q represents an integer of one or greater. Qq+ represents a q-valent organic cation.
Inventors:
NAKAMURA RYOSUKE (JP)
ANDO TOMOYUKI (JP)
YAMADAYA TOKUNORI (JP)
ANDO TOMOYUKI (JP)
YAMADAYA TOKUNORI (JP)
Application Number:
PCT/JP2017/030721
Publication Date:
March 08, 2018
Filing Date:
August 28, 2017
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; C08K3/22; C08K5/49; C08K5/55; C08L63/00; G03F7/038; G03F7/075; G03F7/20
Domestic Patent References:
| WO2009151050A1 | 2009-12-17 | |||
| WO2012008472A1 | 2012-01-19 | |||
| WO2010140527A1 | 2010-12-09 |
Foreign References:
| JP2007291263A | 2007-11-08 | |||
| JP2000122287A | 2000-04-28 | |||
| JP2000347403A | 2000-12-15 | |||
| JPH1097070A | 1998-04-14 | |||
| JP2009092761A | 2009-04-30 | |||
| JP2010007049A | 2010-01-14 | |||
| JP2005250067A | 2005-09-15 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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