Title:
NICKEL PLATING SOLUTION AND NICKEL PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/081274
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a nickel plating solution that does not use boric acid or carboxylic acid, has a pH in the range of low to medium acidity, and retains conventional productivity; and a nickel plating method that uses said nickel plating solution. In order to achieve said purpose, a nickel plating solution for electric plating is used that: includes a pH buffering agent and one or more types of nickel salts which are a supply source for nickel ions; and is characterized by the pH buffering agent being an amino alkane sulfonic acid or a derivative thereof and by having a pH of 4.0-6.5.
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Inventors:
AIKAWA HIROKI (JP)
IIZUKA ATSUSHI (JP)
EMURA SHIGENORI (JP)
IIZUKA ATSUSHI (JP)
EMURA SHIGENORI (JP)
Application Number:
PCT/JP2011/065425
Publication Date:
June 21, 2012
Filing Date:
July 06, 2011
Export Citation:
Assignee:
MELTEX INC (JP)
AIKAWA HIROKI (JP)
IIZUKA ATSUSHI (JP)
EMURA SHIGENORI (JP)
AIKAWA HIROKI (JP)
IIZUKA ATSUSHI (JP)
EMURA SHIGENORI (JP)
International Classes:
C25D3/12
Foreign References:
| JP2005220403A | 2005-08-18 | |||
| JP2001172790A | 2001-06-26 |
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
Katsuhiro Yoshimura (JP)
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Claims: