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Title:
NITROGEN-PLASMA SURFACE TREATMENT IN A DIRECT BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2009/153422
Kind Code:
A8
Abstract:
Two wafers, each having on a surface thereof a thin silicon or silicon oxide film, are bonded by subjecting the thin film of at least one wafer to a surface treatment forming a thin silicon oxynitride surface film with a thickness of less than 5 nm. The thin film is formed by means of a nitrogen-based plasma, generated by an inductively coupled plasma source. In addition, the potential difference between the plasma and a substrate holder supporting said wafer, during the surface treatment, is less than 50 V, advantageously less than 15 V and preferably zero. This makes it possible to obtain a defect-free bonding interface irrespective of the temperature of any heat treatment carried out after the contacting step.

Inventors:
LIBRALESSO LAURE (FR)
MORICEAU HUBERT (FR)
MORALES CHRISTOPHE (FR)
RIEUTORD FRANCOIS (FR)
VENTOSA CAROLINE (FR)
CHEVOLLEAU THIERRY (FR)
Application Number:
PCT/FR2009/000502
Publication Date:
December 23, 2010
Filing Date:
April 28, 2009
Export Citation:
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Assignee:
COMMISSARIAT ENERGIE ATOMIQUE (FR)
LIBRALESSO LAURE (FR)
MORICEAU HUBERT (FR)
MORALES CHRISTOPHE (FR)
RIEUTORD FRANCOIS (FR)
VENTOSA CAROLINE (FR)
CHEVOLLEAU THIERRY (FR)
International Classes:
H01L21/762
Attorney, Agent or Firm:
HECKE, Gérard (10 rue d'Arménie - Europol, BP 1537 Grenoble Cedex 1, FR)
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