Title:
NON-PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/090576
Kind Code:
A1
Abstract:
[Problem] To provide a thermosetting non-photosensitive resin composition. [Solution] A non-photosensitive resin composition which contains: a copolymer that has structural units represented by formula (1) and formula (2); a compound represented by formula (3); and a solvent. (In formula (1), formula (2) and formula (3), each R0 independently represents a hydrogen atom or a methyl group; Y represents an aromatic hydrocarbon group in which some or all hydrogen atoms may be substituted by alkyl groups, alkoxy groups, cyano groups or halogen atoms; R1 represents a divalent organic group that is represented by formula (I), formula (II) or formula (III); in cases where R1 represents a divalent organic group that is represented by formula (I), a carbonyl group in formula (I) is bonded to the main chain of the structural unit represented by formula (2); R2 represents an organic group that has an epoxy group; and R3 represents an alkyl group.) (In the formulae, c represents an integer from 0 to 3; d represents an integer from 1 to 3; and each e independently represents an integer from 2 to 6.)
Inventors:
ADACHI ISAO (JP)
Application Number:
PCT/JP2020/034727
Publication Date:
May 14, 2021
Filing Date:
September 14, 2020
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08G59/68; C08F220/32; G02B1/04; G02B3/00
Domestic Patent References:
| WO2013005619A1 | 2013-01-10 | |||
| WO2019198378A1 | 2019-10-17 |
Foreign References:
| JP2001350010A | 2001-12-21 | |||
| JPH0578453A | 1993-03-30 | |||
| JP2006276048A | 2006-10-12 | |||
| JP2015089916A | 2015-05-11 | |||
| JP2007332200A | 2007-12-27 |
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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