NON-PREHEATING GLUE APPLICATION MACHINE IMPROVING GLUE APPLICATION QUALITY

WIPO Patent Application WO/2023/010597

A1

A non-preheating glue application machine improving glue application quality, comprising a body, a glue pressing roller set provided inside of the body, and a heating assembly close to the glue pressing roller set; the front side of the body is provided with a glue application inlet (10), the glue application inlet (10) is provided with a glue pushing assembly, and the glue pushing assembly and the glue pressing roller set, according to a feeding direction, together successively push an object being glued; the linear speed of the glue pushing assembly is less than the linear speed of the glue pressing roller set, and the static friction force between the glue pressing roller set and the object being glued is greater than the static friction force between the glue pushing assembly and the object being glued; when the object being glued enters the glue pressing roller set by means of the glue pushing assembly, the glue pressing roller set and the object being glued are in static friction fit; at the same time, the glue pushing assembly and the object being glued are in sliding friction fit, so as to avoid directly inserting the object being glued into the glue pressing roller set, thereby performing plastic sealing treatment in a tensioned state so as to improve the glue application quality.

CHEN WENHUI (CN)

PCT/CN2021/111806

February 09, 2023

August 10, 2021

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BONSEN ELECTRONICS LTD (CN)

B05C1/08; B29C63/02; B65B51/16

CN203637291U	2014-06-11
CN109591433A	2019-04-09
CN107362936A	2017-11-21
CN2213621Y	1995-11-29
CN204107763U	2015-01-21
US20110284146A1	2011-11-24

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