Title:
NON-SEWN CLOTHING MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/182285
Kind Code:
A1
Abstract:
The non-sewn clothing manufacturing method according to the present disclosure comprises a step of preparing a urethane prepolymer-containing reactive hot-melt adhesive, a step of forming an adhesive layer by melting the reactive hot-melt adhesive and applying the adhesive to a first fabric with use of a dispenser, a step of obtaining a laminate by placing a second fabric on the adhesive layer and crimping the second fabric, and a step of obtaining a bonded body by hardening the adhesive layer in the laminate, wherein the dispenser has a syringe filled with the reactive hot-melt adhesive and a nozzle attached to the syringe, the temperature of the syringe is set to 60 to 115 ˚C, and the temperature of the nozzle is set to 125 to 190 ˚C.
Inventors:
YAMATO RYOSUKE (JP)
SAITO KOICHI (JP)
KOMIYA SOUICHIROU (JP)
HISANO KAZUKI (JP)
TANAKA KAHO (JP)
SAITO KOICHI (JP)
KOMIYA SOUICHIROU (JP)
HISANO KAZUKI (JP)
TANAKA KAHO (JP)
Application Number:
PCT/JP2023/010939
Publication Date:
September 28, 2023
Filing Date:
March 20, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
B32B5/26; A41H43/04; C09J5/00; C09J7/35; C09J175/04; C09J175/06; C09J175/08
Foreign References:
| JP2021161218A | 2021-10-11 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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