Title:
NON-SLIP PAD FOR SEMICONDUCTOR WAFER TRANSFER HAVING HEAT RESISTANCE AND CONDUCTIVITY
Document Type and Number:
WIPO Patent Application WO/2022/124458
Kind Code:
A1
Abstract:
A non-slip pad mounted on a robot arm for transferring a wafer according to an embodiment of the present invention comprises: a base part mounted on the upper surface of a blade; and a pattern part formed on the upper surface of the base part and including one or more fine patterns, wherein the base part and the pattern part can secure stability even in a high-temperature wafer transfer process by including a flexible base material and a heat-resistant material, and can secure stability of process during an unloading process by neutralizing charges accumulated on a wafer to prevent the occurrence of excessive mounting force caused by electrostatic attraction between the wafer and the non-slip pad.
Inventors:
CHANG DONG JOON (KR)
LEE SEUNG WON (KR)
LEE BOM (KR)
SHIN JIN YONG (KR)
OH YOUNG TAEK (KR)
LEE SEUNG WON (KR)
LEE BOM (KR)
SHIN JIN YONG (KR)
OH YOUNG TAEK (KR)
Application Number:
PCT/KR2020/018290
Publication Date:
June 16, 2022
Filing Date:
December 14, 2020
Export Citation:
Assignee:
GLINT MAT CO LTD (KR)
International Classes:
H01L21/677; B25J11/00; B25J15/00; H01L21/687
Foreign References:
| KR20140109953A | 2014-09-16 | |||
| US20150255322A1 | 2015-09-10 | |||
| US20090061242A1 | 2009-03-05 | |||
| KR20150073873A | 2015-07-01 | |||
| US20150217456A1 | 2015-08-06 |
Attorney, Agent or Firm:
KIM, Yonghoon (KR)
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