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Title:
NOODLES AND NOODLE SKINS COMPRISING SOYBEAN PROTEIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/072656
Kind Code:
A1
Abstract:
It is intended to prepare noodles and noodle skins, in particular, wheat flour-free noodles and noodle skins, which comprise a soybean protein composition at a high ratio. By adding a water-extracted less denatured soybean protein to noodles and noodle skins, noodles and noodle skins containing a large amount of the soybean protein can be obtained. Further, it is possible to obtain wheat flour-free noodles and noodle skins and starch-free noodles and noodle skins.

Inventors:
KANAMORI JIRO (JP)
SAMOTO MASAHIKO (JP)
MIYAMOTO MASAAKI (JP)
Application Number:
PCT/JP2007/073936
Publication Date:
June 19, 2008
Filing Date:
December 12, 2007
Export Citation:
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Assignee:
FUJI OIL CO LTD (JP)
KANAMORI JIRO (JP)
SAMOTO MASAHIKO (JP)
MIYAMOTO MASAAKI (JP)
International Classes:
A23J3/16; A23L7/109; A23L1/305
Domestic Patent References:
WO2006129647A12006-12-07
WO2003022069A12003-03-20
WO2007026674A12007-03-08
WO2002028198A12002-04-11
WO2004043160A12004-05-27
Foreign References:
JPH02409A1990-01-05
JP2001292704A2001-10-23
JP2005523007A2005-08-04
JP2002101835A2002-04-09
JPH0576290A1993-03-30
Other References:
ONO S,: "Shokkan mo Namaraka de Daizushu no Sukunai Namadaizuko no Shinseiho Kaihatsu", BRAIN TECHNO NEWS, vol. 90, 15 March 2002 (2002-03-15), pages 26 - 30
KANEMORI J.: "Daizu Tanpakushitsu o Shiyo shita Tanpaku Lyokamen no Chosei to sono Bussei", NIPPON SHOKUHIN KAGAKU KOGAKU TAIKAI KOENSHU, vol. 54, 6 September 2007 (2007-09-06), pages 114
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