Title:
NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO2005038524
Kind Code:
A3
Abstract:
A positive-working photosensitive composition comprising one or more polybenzoxazole precursor polymers, a diazonaphthoquinone photoactive compound which is the condensation product of a compound containing from 2 to about 9 aromatic hydroxyl groups with a 5-naphthoquinone diazide sulfonyl compound and a 4-naphthoquinone diazide sulfonyl compound, and at least one solvent, and the use of such compositions to form a relief pattern on a substrate thereby forming a coated substrate.
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Inventors:
NAIINI AHMAD A (US)
HOPLA RICHARD (US)
POWELL DAVID B (US)
METIVIER JON (US)
RUSHKIN IL YA (US)
HOPLA RICHARD (US)
POWELL DAVID B (US)
METIVIER JON (US)
RUSHKIN IL YA (US)
Application Number:
PCT/US2004/033861
Publication Date:
June 22, 2006
Filing Date:
October 15, 2004
Export Citation:
Assignee:
ARCH SPEC CHEM INC (US)
International Classes:
G03C5/18; G03F7/022; G03F7/023; G03F
Foreign References:
| US6127086A | 2000-10-03 | |||
| US6177225B1 | 2001-01-23 |
Other References:
See also references of EP 1680711A4
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