Title:
OPTICAL COMMUNICATION MODULE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/176000
Kind Code:
A1
Abstract:
The optical communication module disclosed in the present application comprises: a plate-shaped stem (1); a plurality of leads (2) penetrating the stem (1) via an insulating member (1a); a connecting conductive member (10) formed on the lead top surface and/or the lead side surface of at least one of the plurality of leads (2); a heat sink block (3) provided on the stem (1); a sub-mount (4) fixed to a heat sink block (3) and provided on a flat surface thereof with a metal pattern (5); a semiconductor light-emitting element (6) fixed to the metal pattern (5); and a wire (7) in which a metal ball (7a) formed at one end is adhered to the metal pattern (5), and the other end is adhered to the lead (2) via adhesion to the connecting conductive member (10).
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Inventors:
HIROSHIGE NAO (JP)
Application Number:
PCT/JP2021/005605
Publication Date:
August 25, 2022
Filing Date:
February 16, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/024
Domestic Patent References:
| WO2020066821A1 | 2020-04-02 |
Foreign References:
| JP2018186130A | 2018-11-22 | |||
| JP2013251477A | 2013-12-12 | |||
| JP2001284388A | 2001-10-12 | |||
| JP2004247672A | 2004-09-02 | |||
| JP2006332491A | 2006-12-07 | |||
| JP2005026333A | 2005-01-27 | |||
| JP2001267674A | 2001-09-28 | |||
| US20150125162A1 | 2015-05-07 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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