Title:
OPTICAL CONNECTION COMPONENT AND OPTICAL CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/110700
Kind Code:
A1
Abstract:
The present invention is constituted from a plate-shaped substrate (101) for transmitting intended light, and a resin optical waveguide (102). The resin optical waveguide (102) is constituted from a resin core (103) comprising a resin through which the intended light is transmitted. For example, the resin core (103) is constituted from a photocured resin. The resin optical waveguide (102) uses the air surrounding the resin core (103) as cladding. The resin core (103) has a folded structure which separates from the surface of the substrate (101) and then returns to the surface of the substrate (101), and is connected to each of a first input/output end and a second input/output end of the substrate (101).
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Inventors:
SHIKAMA KOTA (JP)
ARATAKE ATSUSHI (JP)
ARATAKE ATSUSHI (JP)
Application Number:
PCT/JP2019/044283
Publication Date:
June 04, 2020
Filing Date:
November 12, 2019
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
G02B6/125; G02B6/138; G02B6/30; G02B6/42
Domestic Patent References:
WO2018083191A1 | 2018-05-11 |
Foreign References:
JP2005275343A | 2005-10-06 | |||
JP2018533033A | 2018-11-08 | |||
JP2006106480A | 2006-04-20 | |||
US9034222B2 | 2015-05-19 | |||
US20150007812A1 | 2015-01-08 |
Other References:
HOOSE, T. ET AL.: "Hardwired configurable photonic integrated circuits enabled by 3D nanoprinting", 2018 EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION (ECOC, 23 September 2018 (2018-09-23), pages 349 - 354, XP081563438
Attorney, Agent or Firm:
YAMAKAWA, Shigeki et al. (JP)
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