Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2020/166566
Kind Code:
A1
Abstract:
An optical module (100) comprises: an integrated circuit (8) that includes a plurality of second terminal groups (8a, 8b, 8c, 8d) connected to first terminal groups (6a1, 6b1, 6c1, 6d1) of a plurality of respective photoelectric elements (6a, 6b, 6c, 6d), and a plurality of ground terminals (8g1, 8g2, 8g3, 8g4, 8g5); a carrier substrate (7) on which the photoelectric elements (6a, 6b, 6c, 6d) are mounted; and common ground pads (10a, 10b) that are provided on at least one end side of the carrier substrate (7) in a housing (1). The carrier substrate (7) is fixed to the housing (1) on one surface thereof, and has: a plurality of signal wiring parts (7a, 7b, 7c, 7d) interposed between and electrically connected with the first terminal groups (6a1, 6b1, 6c1, 6d1) of the photoelectric elements (6a, 6b, 6c, 6d) and the corresponding second terminal groups (8a, 8b, 8c, 8d) of the integrated circuit (8); and a ground wiring part (7g). The ground wiring part (7g) has a connection part that electrically connects a plurality of terminal pattern parts (7g1, 7g2, 7g3) and common pattern parts (7g4, 7g5) respectively electrically connected to the ground terminals (8g1, 8g2, 8g3, 8g4, 8g5), and the ground terminals (8g1, 8g2, 8g3, 8g4, 8g5) are connected to the common ground pads (10a, 10b) via the ground wiring part (7g).

Inventors:
NAGASHIMA KAZUYA (JP)
ISHIKAWA YOZO (JP)
IZAWA ATSUSHI (JP)
Application Number:
PCT/JP2020/005157
Publication Date:
August 20, 2020
Filing Date:
February 10, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L31/02; G02B6/42; G02F1/01
Foreign References:
JP2014036100A2014-02-24
JP2008251770A2008-10-16
JP2017098616A2017-06-01
JP2014204022A2014-10-27
JP2011216629A2011-10-27
US20050213994A12005-09-29
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: