Title:
OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2022/052527
Kind Code:
A1
Abstract:
An optical module (200), comprising a circuit board (300) and a light-emitting assembly (400), wherein in the light-emitting assembly (400), a semiconductor optical amplification chip (805), a silicon photonic chip (802) and a semiconductor cooler (801) constitute a wavelength tuning mechanism; the semiconductor optical amplification chip (805) provides a plurality of wavelengths; an optical filter in the silicon photonic chip (802) screens the wavelengths; and the semiconductor cooler (801) adjusts the temperature of the optical filter, so as to further adjust the performance of the optical filter screening the wavelengths. Said devices are placed in a shell (600), so as to facilitate the encapsulation of the devices.
Inventors:
LIU WEIWEI (CN)
SHAO QIAN (CN)
YANG LIU (CN)
WU TAO (CN)
SHAO QIAN (CN)
YANG LIU (CN)
WU TAO (CN)
Application Number:
PCT/CN2021/098265
Publication Date:
March 17, 2022
Filing Date:
June 04, 2021
Export Citation:
Assignee:
HISENSE BROADBAND MULTIMEDIA TECHNOLOGY CO LTD (CN)
International Classes:
G02B6/42; H01S5/022
Foreign References:
| CN213122371U | 2021-05-04 | |||
| CN111146683A | 2020-05-12 | |||
| CN110350394A | 2019-10-18 | |||
| CN107611774A | 2018-01-19 | |||
| CN1721899A | 2006-01-18 | |||
| CN110376691A | 2019-10-25 | |||
| US20050084202A1 | 2005-04-21 | |||
| US20160156149A1 | 2016-06-02 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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