Title:
OPTICAL SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/264347
Kind Code:
A1
Abstract:
An optical semiconductor of the present disclosure comprises: a semiconductor substrate (1) of a first conductance type; a stripe-shaped mesa structure (6) comprising a laminate of a cladding layer (2) of the first conductance type, an active layer (4), and a first cladding layer (5) of a second conductance type laminated on the semiconductor substrate (1) of the first conductance type; and a mesa embedding layer (7) comprising a semi-insulating first embedding layer (7a), a second embedding layer (7b) of the first conductance type, and a semi-insulating third embedding layer (7c) doped with a transition metal that are provided sequentially on both side surfaces of the mesa structure (6) above the semiconductor substrate (1) of the first conductance type.
Inventors:
KAWAHARA HIROYUKI (JP)
Application Number:
PCT/JP2021/022984
Publication Date:
December 22, 2022
Filing Date:
June 17, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/227
Domestic Patent References:
| WO2019220514A1 | 2019-11-21 |
Foreign References:
| JPH11266051A | 1999-09-28 | |||
| US6028875A | 2000-02-22 | |||
| JP2009004450A | 2009-01-08 | |||
| JP2009283822A | 2009-12-03 | |||
| JP2010258273A | 2010-11-11 | |||
| JP2011249767A | 2011-12-08 | |||
| JP2003218466A | 2003-07-31 | |||
| JP2014192369A | 2014-10-06 | |||
| US6556605B1 | 2003-04-29 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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