Title:
OPTICAL WAVEGUIDE ELEMENT, OPTICAL MODULATOR, OPTICAL MODULATION MODULE, AND OPTICAL TRANSMISSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/114185
Kind Code:
A1
Abstract:
In an optical waveguide element according to the present invention, good bonding location precision is realized without substrate etching even when the size and spacing of electrode pads is reduced. This optical waveguide element has provided, to a substrate, an optical waveguide and an electrode pad to which a conductive wire is bonded, wherein the electrode pad includes a bonding area at which the conductive wire is bonded, and an intermediate layer is provided between the substrate and the electrode pad and forms a step at a location surrounding the bonding area on the substrate.
Inventors:
OKAHASHI KOSUKE (JP)
Application Number:
PCT/JP2021/043648
Publication Date:
June 02, 2022
Filing Date:
November 29, 2021
Export Citation:
Assignee:
SUMITOMO OSAKA CEMENT CO LTD (JP)
International Classes:
G02F1/035; G02F1/01
Domestic Patent References:
| WO2020202609A1 | 2020-10-08 |
Foreign References:
| JP2008004697A | 2008-01-10 | |||
| JP2018206894A | 2018-12-27 | |||
| JPH05291364A | 1993-11-05 | |||
| JP2014187073A | 2014-10-02 | |||
| JP2019152732A | 2019-09-12 | |||
| JP2019129173A | 2019-08-01 | |||
| US20200064706A1 | 2020-02-27 |
Attorney, Agent or Firm:
KUSHIBUCHI & ASSOCIATES (JP)
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