Title:
MOISTURE-CURABLE RESIN COMPOSITION AND ADHESIVE FOR ELECTRONIC APPLIANCE
Document Type and Number:
WIPO Patent Application WO/2022/114186
Kind Code:
A1
Abstract:
A moisture-curable resin composition including a moisture-curable resin, and giving cured objects which have a shear bonding strength of 4 MPa or higher and an elongation at rupture of 600% or higher and have no glass transition point at temperatures of 10°C and higher.
Inventors:
HAGIWARA KOUHEI (JP)
TAMAGAWA TOMOKAZU (JP)
WANG XIAOGE (JP)
YUUKI AKIRA (JP)
KIDA TAKUMI (JP)
JO KON (JP)
TAMAGAWA TOMOKAZU (JP)
WANG XIAOGE (JP)
YUUKI AKIRA (JP)
KIDA TAKUMI (JP)
JO KON (JP)
Application Number:
PCT/JP2021/043650
Publication Date:
June 02, 2022
Filing Date:
November 29, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; C08G18/08; C08G18/10; C08G18/30; C08K5/10; C08L75/04; C09J4/00; C09J175/04
Domestic Patent References:
| WO2015174371A1 | 2015-11-19 | |||
| WO2016167305A1 | 2016-10-20 | |||
| WO2020149379A1 | 2020-07-23 | |||
| WO2020156802A1 | 2020-08-06 |
Foreign References:
| JP2016150974A | 2016-08-22 | |||
| JP2018514599A | 2018-06-07 | |||
| JP2008133460A | 2008-06-12 | |||
| JPH1135699A | 1999-02-09 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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