Title:
ORGANIC SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2013/031733
Kind Code:
A1
Abstract:
Provided is an organic semiconductor device which uses a film as a sealing material for sealing a laminate and exhibits excellent sealing properties and connection precision with a connection land and an electrode as a consequence of the sealing material and laminate being inhibited from slipping when sealing under reduced pressure conditions. A slide-prevention material (48) for preventing a laminate (12) and a first film base material (14) from slipping when sealing the laminate (12) is disposed between the laminate (12) and the first film base material (14). The positions of a through hole (38) and the electrodes (30, 32) of the laminate (12) are aligned as a consequence of the laminate (12) and the first film base material (14) being prevented from slipping. The electrodes (30, 32) of the laminate (12) are externally drawn out through the through hole (38) by means of a conductive material (40).
Inventors:
HIBINO SHINGO (JP)
HIMURO AYAKO (JP)
TAKAO YUZO (JP)
HIMURO AYAKO (JP)
TAKAO YUZO (JP)
Application Number:
PCT/JP2012/071607
Publication Date:
March 07, 2013
Filing Date:
August 27, 2012
Export Citation:
Assignee:
TOKAI RUBBER IND LTD (JP)
HIBINO SHINGO (JP)
HIMURO AYAKO (JP)
TAKAO YUZO (JP)
HIBINO SHINGO (JP)
HIMURO AYAKO (JP)
TAKAO YUZO (JP)
International Classes:
H05B33/04; H01L31/042; H01L51/42; H01L51/50; H05B33/06
Foreign References:
| JP2011142022A | 2011-07-21 | |||
| JP2011108566A | 2011-06-02 | |||
| JP2007059311A | 2007-03-08 |
Attorney, Agent or Firm:
UENO, NOBORU (JP)
Ueno 登 (JP)
Ueno 登 (JP)
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Claims: