Title:
ORGANIC TREATMENT SOLUTION FOR PATTERNING OF RESIST FILM, METHOD FOR PRODUCING ORGANIC TREATMENT SOLUTION FOR PATTERNING OF RESIST FILM, STORAGE CONTAINER FOR ORGANIC TREATMENT SOLUTION FOR PATTERNING OF RESIST FILM, AND PATTERN FORMATION METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/052393
Kind Code:
A1
Abstract:
Provided are: an organic treatment solution for patterning resist films, containing concentrations of metal elements Na, K, Ca, Fe, Cu, Mg, Mn, Li, Al, Cr, Ni and Zn not exceeding 3ppm, said organic treatment solution for patterning resist films being capable of reducing the occurrence of particles in negative pattern formation of fine patterns (30nm node or less, for example) using an organic treatment solution for patterning of resist film, particularly using an organic developer; a method for producing an organic treatment solution for patterning of resist film; a storage container for organic treatment solution for patterning of resist film; and pattern formation method and electronic device production method using same.
Inventors:
YAMANAKA TSUKASA (JP)
Application Number:
PCT/JP2015/077291
Publication Date:
April 07, 2016
Filing Date:
September 28, 2015
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/32; C01B7/01; G03F7/038; G03F7/039; H01L21/027
Domestic Patent References:
| WO2014069245A1 | 2014-05-08 |
Foreign References:
| JP2009249400A | 2009-10-29 | |||
| JPH0986901A | 1997-03-31 | |||
| JP2009025708A | 2009-02-05 |
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
Takamatsu 猛 (JP)
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