Title:
PACKAGING MATERIAL FOR CELL
Document Type and Number:
WIPO Patent Application WO/2016/052394
Kind Code:
A1
Abstract:
The present invention provides a film-shaped packaging material for a cell in which a coating layer is provided as the outermost layer instead of a substrate layer and an adhesive layer in a conventional film-shaped packaging material for a cell, thereby making it possible to produce a thinner film; wherein the packaging material for a cell is provided with exceptional moldability and insulation performance and enables the lead time to be reduced. The packaging material for a cell is a laminate having at least a coating layer, a barrier layer, and a sealant layer in the stated order, the coating layer comprising a single-layer or a multiple-layer configuration formed by a cured product of a resin composition containing a heat-curable resin and a curing accelerator, the laminate having a piercing strength of at least 5 N, as measured in compliance with JIS 1707:1997, and the coating layer having a breakdown voltage of at least 1.0 kV, as measured in compliance with JIS C2110-1.
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Inventors:
HASHIMOTO YOUHEI (JP)
YAMASHITA RIKIYA (JP)
UEDA SHUNSUKE (JP)
YAMASHITA RIKIYA (JP)
UEDA SHUNSUKE (JP)
Application Number:
PCT/JP2015/077293
Publication Date:
April 07, 2016
Filing Date:
September 28, 2015
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B7/02; B32B27/20; B65D65/40; H01M50/119; H01M50/121; H01M50/129; H01M50/133
Domestic Patent References:
| WO2014156904A1 | 2014-10-02 |
Foreign References:
| JP2015084314A | 2015-04-30 | |||
| JP2015088451A | 2015-05-07 | |||
| JP2007173049A | 2007-07-05 | |||
| JP2002056823A | 2002-02-22 |
Attorney, Agent or Firm:
Yamada, Iichiro et al. (JP)
Yamada 威 1 郎 (JP)
Yamada 威 1 郎 (JP)
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