Title:
PACKAGE APPARATUS COMPRISING CAPACITOR DISPOSED OPPOSITE DIE BASED ON SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/215851
Kind Code:
A1
Abstract:
A package apparatus (300) according to one embodiment may comprise: a substrate (310); a plurality of upper lands (311) disposed on one surface of the substrate (310); a plurality of upper solder balls (331) disposed on the plurality of upper lands (311); a die (320) connected to the plurality of upper solder balls (331); a plurality of lower lands (312) disposed on the other surface of the substrate (310); a plurality of lower solder balls (332) disposed on some of the plurality of lower lands (312); and a capacitor (340) connected to the lower lands on which the lower solder balls are not disposed from among the plurality of lower lands (312), provided on the opposite side of the die (320), and having a height greater than a height of the lower solder balls (332).
Inventors:
LEE SANGHO (KR)
KIM KIHYUN (KR)
PARK SANGYONG (KR)
BAEK KWANGHYUN (KR)
BAEK SEUNGJAE (KR)
KIM KIHYUN (KR)
PARK SANGYONG (KR)
BAEK KWANGHYUN (KR)
BAEK SEUNGJAE (KR)
Application Number:
PCT/KR2022/002136
Publication Date:
October 13, 2022
Filing Date:
February 14, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H01L23/64; H01L23/00; H01L23/485; H01L23/492; H01L23/528
Foreign References:
| US20190311978A1 | 2019-10-10 | |||
| KR20110139983A | 2011-12-30 | |||
| KR20100107408A | 2010-10-05 | |||
| KR20130033808A | 2013-04-04 | |||
| KR20130023383A | 2013-03-07 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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