Title:
PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO-CONTROLLED CLOCK
Document Type and Number:
WIPO Patent Application WO/2010/097905
Kind Code:
A1
Abstract:
Provided is a package manufacturing method by which an electronic component can be packaged in a cavity formed between a plurality of substrates bonded to each other. The method has a through electrode forming step of forming a through electrode, which penetrates a first substrate among the substrates in the thickness direction and permits a current to be carried between the inside of the cavity and the outside of the package. The through electrode forming step has a through hole forming step of forming a through hole on the first substrate for arranging the through electrode, and a filling step of filling the through hole with a filling material under depressurized atmosphere.
Inventors:
FUNABIKI YOICHI (JP)
NUMATA MASASHI (JP)
SUGAMA KAZUYOSHI (JP)
NUMATA MASASHI (JP)
SUGAMA KAZUYOSHI (JP)
Application Number:
PCT/JP2009/053334
Publication Date:
September 02, 2010
Filing Date:
February 25, 2009
Export Citation:
Assignee:
SEIKO INSTR INC (JP)
FUNABIKI YOICHI (JP)
NUMATA MASASHI (JP)
SUGAMA KAZUYOSHI (JP)
FUNABIKI YOICHI (JP)
NUMATA MASASHI (JP)
SUGAMA KAZUYOSHI (JP)
International Classes:
H03H9/02; H03H3/02; H03H9/19; H03H9/21; H03H9/215
Foreign References:
| JP2006295246A | 2006-10-26 | |||
| JP2007235121A | 2007-09-13 | |||
| JP2003218200A | 2003-07-31 | |||
| JP2003209198A | 2003-07-25 |
Attorney, Agent or Firm:
MATSUSHITA, YOSHIHARU (JP)
Matsushita Yoshiharu (JP)
Matsushita Yoshiharu (JP)
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