PACKAGE FOR MATERIAL CONTAINING NONAQUEOUS SOLVENT AND CELL COMPRISING THE SAME

Title:

PACKAGE FOR MATERIAL CONTAINING NONAQUEOUS SOLVENT AND CELL COMPRISING THE SAME

Document Type and Number:

WIPO Patent Application WO/2001/056096

Kind Code:

A1

Abstract:

A package for a material containing a non-aqueous solvent, which water enters little from outside and has a strength hardly degrading for a long time and a non-aqueous electrolyte cell having a long life and a high reliability are disclosed. A package for a material containing a non-aqueous solvent having a baglike structure in which part of a film of a lamination of metallic layers and resin layers is bonded, wherein an organic layer between the metallic layers of the bonded part includes a structure for suppressing the penetration of the non-aqueous solvent contained in the package.

Inventors:

YOSHIDA YASUHIRO (JP)
HIROI OSAMU (JP)
NAKAO YUKIYASU (JP)
SHIOTA HISASHI (JP)
AIHARA SHIGERU (JP)
TAKEMURA DAIGO (JP)
URUSHIBATA HIROAKI (JP)
MURAI MICHIO (JP)
KURATA TETSUYUKI (JP)

Application Number:

PCT/JP2000/000308

Publication Date:

August 02, 2001

Filing Date:

January 24, 2000

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)
YOSHIDA YASUHIRO (JP)
HIROI OSAMU (JP)
NAKAO YUKIYASU (JP)
SHIOTA HISASHI (JP)
AIHARA SHIGERU (JP)
TAKEMURA DAIGO (JP)
URUSHIBATA HIROAKI (JP)
MURAI MICHIO (JP)
KURATA TETSUYUKI (JP)

International Classes:

B32B15/08; B65D30/08; (IPC1-7): H01M2/08; B32B15/08; H01M2/02

Foreign References:

JPH08287889A	1996-11-01
JPH06302305A	1994-10-28
JPH11312505A	1999-11-09
JPH11195405A	1999-07-21
JPH0380964U	1991-08-19

Other References: