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Title:
PACKAGE METHOD FOR RADIO-FREQUENCY MODULE, AND RADIO-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2024/027571
Kind Code:
A1
Abstract:
Provided are a package method for a radio-frequency module, and a radio-frequency module, which are applicable to the field of die packaging. The method comprises: performing front-end manufacturing on a substrate; pre-assembling, on the surface of the substrate, a radio-frequency die device that includes a filter, and determining the fixed position of the radio-frequency die device; performing primary SMT treatment on the substrate; performing organic adhesive film coating treatment on the surface of the substrate; performing laser film melting according to the position of an organic adhesive film required by a passive element, so as to form an exposed contact; performing secondary SMT treatment on the surface of the organic adhesive film; and performing plastic packaging on the substrate and the radio-frequency die device, and performing cutting and packaging to obtain a radio-frequency module. Thus, on the basis of original BDMP, the packaging of passive capacitor and inductor components can be realized.

Inventors:
HU JINZHAO (CN)
CHEN YUN (CN)
LUO WEIXIA (CN)
LI SHUAI (CN)
YANG RUIZHI (CN)
ZHANG LEI (CN)
GUO JIASHUAI (CN)
Application Number:
PCT/CN2023/109737
Publication Date:
February 08, 2024
Filing Date:
July 28, 2023
Export Citation:
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Assignee:
LANSUS TECH INC (CN)
International Classes:
H01P1/20; H01L23/28; H01L23/31
Foreign References:
CN115000654A2022-09-02
CN114823651A2022-07-29
CN113035855A2021-06-25
CN114157263A2022-03-08
US20060194370A12006-08-31
Attorney, Agent or Firm:
SHENZHEN JUNXINCHENG INTELLECTUAL PROPERTY FIRM (GENERAL PARTNERSHIP) (CN)
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