Title:
PACKAGE FOR MOUNTING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/098455
Kind Code:
A1
Abstract:
Provided are: a package for mounting an electronic component with which it is possible to make heat distribution in a curved electronic component mounting section uniform; and an electronic device. A package 1 for mounting an electronic component comprises: a first principal surface and a second principal surface; a substrate 2 which is provided in the first principal surface and which comprises a concave section 2d or a convex section 2e that is arc-shaped in a vertical cross-sectional view; and a curved electronic component mounting section 11 which is provided in the concave section 2d or the convex section 2e and on which a bowed curved electronic component 10 is mounted. The substrate 2, when viewed in a plan perspective view from the side of the first principal surface, comprises a cutaway 4 in the second principal surface so as to overlap the curved electronic component mounting section 11.
Inventors:
YAMADA HIROSHI (JP)
OKAMURA TAKUJI (JP)
FUNAHASHI AKIHIKO (JP)
OKAMURA TAKUJI (JP)
FUNAHASHI AKIHIKO (JP)
Application Number:
PCT/JP2015/080212
Publication Date:
June 23, 2016
Filing Date:
October 27, 2015
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12; H01L23/36; H01L27/14; H01L33/64; H04N5/369
Foreign References:
| JP2005136325A | 2005-05-26 | |||
| JP2012114189A | 2012-06-14 | |||
| JP2008294960A | 2008-12-04 | |||
| JP2009071251A | 2009-04-02 |
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