PACKAGE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE EMPLOYING THE SAME

Title:

PACKAGE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE EMPLOYING THE SAME

Document Type and Number:

WIPO Patent Application WO/2007/142018

Kind Code:

A1

Abstract:

A highly reliable package for mounting an optical semiconductor element in which good adhesion is ensured between a resin molding and a lead electrode, and an optical semiconductor device employing it. The package for mounting an optical semiconductor element has a recess to be an optical semiconductor element mounting region and is characterized in that a resin molding composed of a thermosetting light reflecting resin composition forming at least the side face of the recess is integrated with at least a pair of positive and negative lead electrodes arranged oppositely to form a part of the bottom face of the recess and the bonding surface of the resin molding and the lead electrode has no gap. An optical semiconductor device employing it is also provided.

Inventors:

URASAKI NAOYUKI
YUASA KANAKO

Application Number:

PCT/JP2007/060385

Publication Date:

December 13, 2007

Filing Date:

May 21, 2007

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)
URASAKI NAOYUKI
YUASA KANAKO

International Classes:

H01L33/48; H01L33/60; H01L33/62

Foreign References:

JP2006140207A	2006-06-01
JP2005146191A	2005-06-09
JP2005136379A	2005-05-26
JPH0889789A	1996-04-09
JP2003327667A	2003-11-19
JP2002280616A	2002-09-27
JP2004055632A	2004-02-19
JP2004342782A	2004-12-02
JP2006154652A	2006-06-15

Other References: