PACKAGE FOR OPTICAL MODULE - NIPPON TELEGRAPH & TELEPHONE

Title:

PACKAGE FOR OPTICAL MODULE

Document Type and Number:

WIPO Patent Application WO/2014/006873

Kind Code:

A1

Abstract:

To provide a package for an optical module which allows for high-density arrangement and provides increased reliability by dispersing the stress concentration in a ceramic wiring substrate during thermal expansion to prevent the generation of cracks. The package for the optical module includes a plate metal base and a ceramic wiring substrate having a plurality of terminals aligned thereon in the longitudinal direction, the ceramic wiring substrate being bonded to the upper surface of the metal base by brazing. The ceramic wiring substrate has a shape-changing portion which changes in shape along the longitudinal direction, and a region not including the transforming portion is bonded to the metal base by brazing. The shape-changing portion in the ceramic wiring substrate is a portion wherein the width along the longitudinal direction changes or a portion wherein the thickness along the longitudinal direction changes.

Inventors:

OGAWA IKUO (JP)
KASAHARA RYOICHI (JP)
NISHIZAWA TOSHIKI (JP)
MITSUHASHI YUJI (JP)

Application Number:

PCT/JP2013/004074

Publication Date:

January 09, 2014

Filing Date:

July 01, 2013

Export Citation:

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Assignee:

NIPPON TELEGRAPH & TELEPHONE (JP)
NTT ELECTRONICS CORP (JP)

International Classes:

H01S5/022; H01L31/02

Foreign References:

JP2008306100A	2008-12-18
JP2002343982A	2002-11-29
JP2011188132A	2011-09-22
JP2012242400A	2012-12-10
JP4934733B2	2012-05-16

Other References: